Ceramic bond diamond grinding wheel has the common characteristics of diamond and ceramic bond, compared with ordinary corundum, silicon carbide abrasive, its grinding force is strong, the grinding temperature is relatively low, the wear of the abrasive is relatively small; It can adapt to the role of various coolants; The shape of the abrasive tool is well maintained during grinding, and the precision of grinding the workpiece is high; There are more pores in the abrasive, which is conducive to chip removal and heat dissipation during grinding, and is not easy to block and burn the workpiece; The self-sharpening of the abrasive is relatively good, the time between dressing is long, and the trimming is easier. Therefore, ceramic bond diamond grinding wheels are increasingly used in some developed countries abroad.
Choose reasonable process parameters, ceramic bond diamond grinding wheel grinding single crystal diamond, grinding efficiency is higher than metal bond grinding wheel, wear ratio is very small, low processing cost, so the use of ceramic bond grinding wheel grinding single crystal diamond, can greatly improve the sky-breaking grinding efficiency. In terms of grinding PCD tools, due to the soft resin bond, it is easy to deform during grinding, and PCD tools cannot be effectively sharpened; The metal bond has poor self-sharpening and low grinding efficiency due to the strong binding ability to the abrasive particles, and the metal bond grinding wheel will cause the most serious damage to the edge of the PCD tool; Combined with grinding efficiency, durability and processing quality of workpiece surface, ceramic bond diamond grinding wheel is the most suitable choice for grinding PCD tools.